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Latest Component Solutions News
CXD2820R
The World's First Demodulator LSI for "DVB-T2" Terrestrial Digital Broadcast Standard.
The CXD2820R is a demodulator LSI for high-definition television use conforming to the "DVB-T2" (Digital Video Broadcasting - Terrestrial 2) terrestrial digital broadcast standard adopted in the UK. This LSI is the world's first*1 demodulator LSI for "DVB-T2"*2, compatible with three standards ("DVB-T2", "DVB-T"*3 and "DVB-C"*4) contributing to product miniaturization and reduction of components.
ICX681SQW
Diagonal 7.763 mm (Type 1/2.3) 14.2M-Effective Pixel High-Resolution Consumer Digital Still Camera CCD Image Sensor Supports 720p Moving Picture and 1/4 Resolution Still Picture Imaging.
In addition to the needs for even higher resolution in the consumer compact digital still camera market, there are also increasing needs for improved high ISO sensitivity and wider dynamic range. Sony has now developed unique fine pixel fabrication technologies and has used these to create the ICX681SQW 1.43 µm unit pixel CCD image sensor, which features the industry's smallest*1 unit pixel. At the same time as increasing resolution by increasing the number of pixels, Sony has also achieved excellent imaging characteristics. This CCD image sensor also achieves high-definition television equivalent (720p) video imaging and high-sensitivity continuous still imaging (3.55M pixels at 5.389 frame/s).
SLD266ZS
Eight-Beam Laser Diode Achieves Faster Printing and Higher Resolution.
Even higher printing speeds and higher resolution are desired in the high-speed digital copiers in the high-end OA equipment market. Thus an even higher number of beams are needed in the multibeam laser diodes used as the light source in the laser printer. Sony has now developed the SLD266ZS, a new 8-beam laser diode with a 30 µm pitch as an addition to the existing lineup. In addition to taking full advantage of the multibeam technology Sony has fostered to date, this device also adopts new technologies to achieve low crosstalk, high reliability, and an even higher level of evenness in the laser characteristics.
ACX405AKM
Transmissive LED Backlit 7.54 cm (3.0-Type) LCD Module Features the 3:2 Aspect Ratio Used by 35mm Film and Digital Single-Lens Reflex Cameras and Achieves an Extremely Wide Viewing Angle.
The ACX405AKM is a 7.54 cm 3:2 aspect ratio active matrix panel module with a built-in low-temperature polysilicon transistor driver with a dedicated backlight. This module adopts the Sony-developed VSPEC III™ wide viewing angle technology, which has been well-received in the digital still camera display market and achieves ultrafine pixels with 1.03M dots (720 × RGB × 480) with the same 3:2 aspect ratio as the images taken by 35mm film cameras and digital single-lens reflex cameras. This module also improves the viewing angle from diagonal directions over current VSPEC III™ models.
IMX050CQK
Diagonal 7.59 mm (Type 1/2.3)10.34M-Effective Pixel High-Speed, High-Sensitivity Back-Illuminated CMOS Image Sensor for Consumer Digital Still Cameras.
In June 2008, Sony announced the development of a back-illuminated CMOS image sensor and in January 2009 led the industry in announcing the first commercial release of a back-illuminated CMOS image sensor for digital video cameras. Compared to current products, these devices achieve twice the sensitivity and make it possible to capture high-quality video even in low light.
CXD4122GG
Second-Generation Imaging System IC for High-Speed Digital Still Cameras Supports "Exmor R"*1.
Sony is committed to bringing to even more people the high-speed imaging world*2 with high-speed imaging for selecting a single instant and high-speed video that captures motion that otherwise could not be seen. Towards this end, Sony has now developed the CXD4122GG, a second-generation camera system IC for digital still cameras that achieves power savings and reduces total system costs. The CXD4122GG supports the IMX050CQK*3 back-illuminated CMOS image sensor, allowing Sony to provide the IMX050CQK and CXD4122GG combination as the best solution for high-speed camera systems.
ISX005 / ISX006
The ISX005 and ISX006 that Sony has now developed are system on chip (SOC) image sensors that provide both a 1.4 µm unit pixel CMOS image sensor and camera system functionality on the same chip. These devices provide a wide range of camera system functions and a Sony-developed compact yet high-performance image-processing engine on a single chip. Thus they can contribute to further miniaturization and thinner forms in cellular phones that includes camera functionality.
IMX072PQ / IMX073PQ / IMX074PQ
Due to the recent improvements in the communication infrastructure and falling prices for data storage, it is now possible for ordinary users to handle large amounts of data on cellular phones. Due to these developments, there are now increasing demands for imaging performance that exceeds the framework of existing cellular phone camera functionality, including demands for even higher picture quality and even higher resolution in both still and moving images. Sony has now developed their product line 5M-pixel, 8M-pixel, and 13M-pixel CMOS image sensors with a 1.4 µm unit pixel, the industry's smallest*1, and that provide full HD video imaging (1080p at 30 frame/s). Due to improvements in process technology and the development of a new condensing structure, Sony can now provide diverse solutions that achieve a S/N ratio even higher than current Sony products.
CXD3267AGG / CXD3268AGW
The World's First TransferJet™ Compliant Close Proximity Wireless Transfer ICs
A world in which devices can be connected simply by bringing them together... The CXD3267AGG and CXD3268AGW that Sony has now developed are wireless ICs that support the "TransferJet" standard for close proximity wireless transmission technology*1. The TransferJet Consortium has defined the standard for this technology. These ICs implement "TransferJet" functions with a minimal number of external components and provide wireless, signal-processing, and host interface functions in a single package using a CMOS fabrication process.



